Post by Corintis

Our collaboration with Microsoft is featured in IEEE Spectrum this month, highlighting a breakthrough in solving the AI "heat wall." The article details how Corintis is moving thermal management from external solutions to integrated, in-chip cooling ❄️. By etching microscopic channels directly into the silicon, we achieved a 3x increase in heat removal efficiency and an over 80% reduction in temperature compared to standard baselines. This approach ensures every droplet of coolant is used effectively, paving the way for the sustainable scaling of high-performance AI. Full story: https://lnkd.in/e-P7Yawc #Corintis #Semiconductors #LiquidCooling #AI #Microsoft #FutureOfCompute