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New COM-HPC Mini with Qualcomm Dragonwing for high-performance ARM computing   We just introduced our first COM-HPC Mini module powered by the Qualcomm Dragonwing™ IQ-X Series - bringing embedded high-performance ARM computing to markets that until now relied almost exclusively on x86 designs. This launch opens the door for a new class of edge and AI systems:  • Up to 12 Qualcomm® Oryon™ cores  • Up to 45 TOPS AI performance via the Qualcomm® Hexagon™ NPU  • Robust Mini form factor with industrial temperature support  • High-bandwidth interfaces for AI, vision, and connected devices  • Seamless Windows support and UEFI firmware for faster integration For us, this isn’t “just another module.” It’s the starting point of a broader roadmap to bring high-performance ARM into applications like video analytics, robotics, medical, security, and advanced edge systems. And with aReady.COM, customers can deploy faster thanks to pre-installed OS options and validated software building blocks. Want the full story? Here’s the press release: 👉https://lnkd.in/dUsxTDCh Full specs & product page: 👉 https://lnkd.in/dDqieT6p Qualcomm PICMG #Dragonwing #ARM #EdgeAI #COMHPC #EmbeddedComputing

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