Post by ZEISS Microscopy

𝟭 𝗗𝗮𝘆 𝗧𝗼 𝗚𝗼! 𝗦𝗲𝗲 𝗕𝗲𝘆𝗼𝗻𝗱 𝘁𝗵𝗲 𝗣𝗮𝗰𝗸𝗮𝗴𝗲: 𝗣𝗿𝗲𝗰𝗶𝘀𝗶𝗼𝗻 𝟯𝗗 𝗜𝗻𝘀𝗶𝗴𝗵𝘁𝘀 High‑resolution 3D X‑ray inspection from full boards to fine interconnects What if you could see every solder joint, via, and bond wire in your electronics - in native 3D, without sectioning or potting the board? Voids, micro‑cracks, and delamination that threaten electronics reliability are usually hidden inside packages and multi‑layer boards, far beyond what surface inspection can reveal. Sectioning and polishing surfaces is slow, destructive, and ultimately provides only limited 2D information about a 3D problem. Join our upcoming webinar to discover how ZEISS Versa X‑ray Microscopy (XRM) brings precision inside the package, delivering non‑destructive, high‑resolution 3D insight from full boards to fine interconnects. Webinar details 𝗙𝗿𝗼𝗺 𝗠𝗶𝗰𝗿𝗼𝘀𝘁𝗿𝘂𝗰𝘁𝘂𝗿𝗮𝗹 𝗗𝗲𝘁𝗮𝗶𝗹 𝘁𝗼 𝗘𝗻𝗴𝗶𝗻𝗲𝗲𝗿𝗶𝗻𝗴 𝗦𝗰𝗮𝗹𝗲: 𝟯𝗗 𝗫‑𝗿𝗮𝘆 𝗜𝗺𝗮𝗴𝗶𝗻𝗴 𝗳𝗼𝗿 𝗠𝗮𝘁𝗲𝗿𝗶𝗮𝗹𝘀 𝗗𝗶𝘀𝗰𝗼𝘃𝗲𝗿𝘆 𝗗𝗮𝘁𝗲: 𝟮 𝗝𝘂𝗹𝘆 𝟮𝟬𝟮𝟲 𝗧𝗶𝗺𝗲: 𝟭𝟬:𝟬𝟬 – 𝟭𝟭:𝟯𝟬 𝗔𝗠 𝗜𝗦𝗧 In this session, you’ll see how electronics engineers and materials scientists can: - Inspect complete PCBs, packages, and connectors in 3D while preserving the sample - Zoom from board‑level architecture down to micro‑scale features in a single workflow - Use quantitative 3D data to accelerate root‑cause analysis and quality decisions Whether you work in electronic packaging, PCB manufacturing, reliability engineering, or academic research, this webinar will show how multiscale 3D X‑ray imaging links the materials inside your electronics to the reliability your customers expect. 𝗥𝗲𝗴𝗶𝘀𝘁𝗲𝗿 𝗻𝗼𝘄! https://lnkd.in/d3akHbbx #ZEISS #XrayMicroscopy #VersaXRM #MaterialCharacterization #MaterialsScience #NonDestructiveTesting #XrayCT #AdvancedMaterials #AdditiveManufacturing #InnovationInMaterials #MultiscaleImaging

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