Post by BOND-IQ GmbH
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š« šš¼š¼šøš¶š»š“ šš®š°šø - āļø 0ļøā£3ļøā£ (https://lnkd.in/dk22v5rM) šš¶š“šµš¹š¶š“šµšš š³šæš¼šŗ š¼ššæ š©šŖ šŖš¶šæš²šÆš¼š»š±š¶š»š“ š„š¼šš»š±šš®šÆš¹š² (šš) š©šŖ At our regular šŖš¶šæš²šÆš¼š»š±š¶š»š“ š„š¼šš»š±šš®šÆš¹š² events, professionals and experts in wire bonding technologies come together to exchange practical insights and innovative solutions. In some of these great events, we were joined by over šÆ participants, collectively representing more than 1,000 years 𤯠of industry experience. šø šš²š šš¶š“šµš¹š¶š“šµšš šš¶šš°šššš²š± šø š April 03, 2025 šµļøāāļø š¦ššæš³š®š°š² š¤šš®š¹š¶šš & ššš¶š±š²š¹š¶š»š²š: A new comprehensive guideline with more than 140 pages was introduced, focusing on optimal surfaces for wire bonding, including aspects of storage, cleaning, testing, and coating systems. š šš¼š»š±š¶š»š“ š£šæš¼š°š²šš š¦šš®šÆš¶š¹š¶šš: Participants discussed practical issues regarding stable bonding processes, highlighting the significant effects of factors like temperature and protective gas atmospheres. š§° šš»š»š¼šš®šš¶šš² š§š²ššš¶š»š“ š š²ššµš¼š±š: Techniques such as single-wire bond testing were explored for their efficiency in quickly identifying surface quality defects and bonding issues. 𤩠A particularly insightful discussion revolved around the stability of š³šæš²š²-š®š¶šæ šÆš®š¹š¹š š¶š» šÆš®š¹š¹-šš²š±š“š² šÆš¼š»š±š¶š»š“. Nico presented compelling data indicating that temperature significantly influences free-air-ball formation and stability. His research highlighted distinct patterns, revealing noticeable temperature-driven variations affecting the bonding results. These findings prompted a lively dialogue on potential contributing factors, including the role of protective gas flow and initial bonding conditions. Valuable feedback and suggestions for further detailed analyses were offered, underscoring the depth and practical value of the insights exchanged. Sessions like these clearly demonstrate ššµš² š½š¼šš²šæ š¼š³ š°š¼š¹š¹š²š°šš¶šš² šøš»š¼šš¹š²š±š“š² š®š»š± š»š²ššš¼šæšøš¶š»š“ š within the wire bonding community. Whether you're facing specific technical challenges, exploring innovative techniques, or aiming to remain updated on industry best practices, our wirebonding roundtable warmly welcomes your participation. We invite you to join our next event ā your experience and insights could help shape future innovations and drive collective progress. ā š„š²š“š¶šššæš®šš¶š¼š» š©šŖ https://lnkd.in/dk22v5rM š https://lnkd.in/djBwbbj9 Have a great day & successful wire bonding ššÆ #wirebondingwinners šŖš» ā¬ļøā¬ļøā¬ļø š Bond IQ ā Training & Support in Wire Bonding (EN) ā”ļø explore our services https://www.bond-iq.com/ #wirebonding #drahtbonden #Semiconductor #ICpackaging #AdvancedPackaging