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💫 𝗟𝗼𝗼𝗸𝗶𝗻𝗴 𝗕𝗮𝗰𝗸 - ⭐️ 0️⃣2️⃣ (https://lnkd.in/dk22v5rM) 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀 𝗳𝗿𝗼𝗺 𝗼𝘂𝗿 🇩🇪 𝗪𝗶𝗿𝗲𝗯𝗼𝗻𝗱𝗶𝗻𝗴 𝗥𝗼𝘂𝗻𝗱𝘁𝗮𝗯𝗹𝗲 (𝗗𝗘) 🇩🇪 At our regular 𝗪𝗶𝗿𝗲𝗯𝗼𝗻𝗱𝗶𝗻𝗴 𝗥𝗼𝘂𝗻𝗱𝘁𝗮𝗯𝗹𝗲 events, professionals and experts in wire bonding technologies come together to exchange practical insights and innovative solutions. In some of these great events, we were joined by over 💯 participants, collectively representing more than 1,000 years 🤯 of industry experience. 🔸 𝗞𝗲𝘆 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀 𝗗𝗶𝘀𝗰𝘂𝘀𝘀𝗲𝗱 🔸 📆 May 22, 2025 ⚡️🔋 A key highlight from our recent session was a deep exploration of 𝗵𝗶𝗴𝗵-𝘃𝗼𝗹𝘁𝗮𝗴𝗲 wire bonding applications, especially involving 𝗦𝗶𝗖 (𝗦𝗶𝗹𝗶𝗰𝗼𝗻 𝗖𝗮𝗿𝗯𝗶𝗱𝗲) chips. Rolf Demitz from Viscom brought to the forefront pressing challenges related to maintaining safe isolation distances and distinguishing between conductive and non-conductive particle contamination around guard rings. This sparked a lively and insightful exchange, further enhanced by expert contributions from Hitachi, reinforcing industry-wide concerns about particle contamination and the critical need for meticulous inspection practices to ensure reliability and safety. 🔬We also delved deeply into advanced 𝗺𝗶𝗰𝗿𝗼𝘀𝗰𝗼𝗽𝘆 𝘁𝗲𝗰𝗵𝗻𝗶𝗾𝘂𝗲𝘀 𝗳𝗼𝗿 𝘀𝘂𝗿𝗳𝗮𝗰𝗲 𝗶𝗻𝘀𝗽𝗲𝗰𝘁𝗶𝗼𝗻. Stefan shared Bond IQ’s latest experiences following their acquisition of a high-resolution microscope with specialized optics. Through detailed comparative images, participants clearly saw how high-quality, color-corrected objectives vastly improve the detection of subtle surface defects, such as fine scratches and crucial residues left by washing processes. This segment of our discussion emphasized that even minor residues could significantly impact wire bonding quality, underlining the importance of precise surface inspection and stringent cleanliness standards. These focused discussions demonstrate our ongoing commitment to tackling real-world, practical technical challenges critical to the wire bonding industry's continued success. We warmly invite professionals interested in wire bonding technologies to participate in our upcoming Drahtbonden sessions – a unique opportunity to share knowledge, tackle challenges collaboratively, and stay closely connected to industry developments. ✅ 𝗥𝗲𝗴𝗶𝘀𝘁𝗿𝗮𝘁𝗶𝗼𝗻 🇩🇪 https://lnkd.in/dk22v5rM 🌐 https://lnkd.in/djBwbbj9 Have a great day & successful wire bonding 🚀💯 #wirebondingwinners 💪🏻 ⬇️⬇️⬇️ 🌐 Bond IQ – Training & Support in Wire Bonding (EN) ➡️ explore our services https://www.bond-iq.com/ #wirebonding #drahtbonden #Semiconductor #ICpackaging #AdvancedPackaging