Post by Besi Switzerland AG

We’re looking forward to ECTC 2026—the premier international conference for electronic packaging technology—where the industry’s leading experts come together to shape the future of advanced packaging. At Besi, we continue to focus on the manufacturing readiness required to enable next‑generation architectures. As device complexity scales, so does the need for robust, high‑yield assembly solutions capable of supporting complex integration, chiplets, and heterogeneous systems at volume. ECTC remains a critical forum for deep technical exchange, and we look forward to engaging with peers, partners, and customers on the process challenges and opportunities defining advanced semiconductor assembly. Besi Austria GmbH Besi Netherlands B.V. #ECTC2026 #AdvancedPackaging #HeterogeneousIntegration #Chiplets #SemiconductorManufacturing #BesInnovation