Post by Besi Switzerland AG

📢 Join Besi at IMAPS CHIPcon 2026 As AI and HPC systems scale, advanced packaging is becoming the critical enabler of performance and integration. At CHIPcon, Debbie Claire Sanchez will present: “Bridging Performance and Integration: The Role of Thermo-Compression and Hybrid Bonding in HPC Advanced Packaging.” Discover how TCB and hybrid bonding are driving the next generation of chiplet-based architectures. 📍 Santa Clara, CA 📅 July 6–8, 2026 #BesInnovation #AdvancedPackaging #HybridBonding #TCB #Chiplets #HPC #IMAPS #CHIPcon2026 Besi Austria GmbH