Post by Besi Switzerland AG

🚀 Fluxless Thermo‑Compression Bonding (TCB) is rapidly becoming a cornerstone for high‑density semiconductor integration. As interconnect pitches continue to shrink and die sizes grow, fluxless TCB is emerging as a critical enabler—delivering cleaner interfaces, tighter process control, and improved yield for advanced 2D, 2.5D, and 3D packaging. At the 45th Chemnitz Seminar (6–7 May 2026), Besi's Martin Kainz will share insights into how fluxless TCB is scaling to support next‑generation architectures for AI, HPC, and heterogeneous integration—where precision, reliability, and throughput matter most. 📍 Join us in Chemnitz, Germany, and learn how this bonding approach is shaping the future of advanced packaging. Besi Austria GmbH Besi Netherlands B.V. #Besi #FluxlessTCB #ThermoCompressionBonding #AdvancedPackaging #HeterogeneousIntegration #AIHardware #SemiconductorManufacturing #BesInnovation