Post by Besi Switzerland AG

📈 High‑density interconnect is redefining AI and HPC performance. As interconnect pitch continues to scale and power efficiency becomes critical, fluxless thermo‑compression bonding (TCB) and hybrid bonding are emerging as key enablers for next‑generation AI/HPC architectures—supporting higher I/O density, improved reliability, and tighter process control. 📍 Join Besi at the IMAPS Italy Workshop – Advanced Packaging 🗓 05 May 2026 | Milan, Italy Our session will explore recent advances in fluxless TCB and hybrid bonding, with a focus on defectivity, metrology, and manufacturing considerations required to bring these technologies into high‑volume production. Looking forward to insightful technical discussions with the advanced packaging community. #Besi #BesInnovation #IMAPSItaly #AdvancedPackaging #FluxlessTCB #HybridBonding #AIHardware #HPC #SemiconductorManufacturing #HighDensityInterconnect Besi Austria GmbH Gianmaria Durastante