Post by Besi Switzerland AG

🚀 Powering the Next Generation of AI Chips — Together with Applied Materials Besi is proud to collaborate with Applied Materials on the newly introduced Kinex™ Bonding System — the industry’s first integrated die-to-wafer hybrid bonder. As the complexity of AI and high-performance computing chips increases, so does the demand for greater integration, accuracy, and performance efficiency. The Kinex system brings together Applied’s front-end materials engineering expertise with Besi’s high-precision die placement and assembly technology, enabling: ✅ Superior die-level tracing for complex multi-die packages ✅ Smaller interconnect pitches with high bonding accuracy ✅ Improved bonding consistency through integrated process control ✅ Faster overlay and drift detection via in-line metrology This collaboration represents a major step toward scaling hybrid bonding for advanced logic and memory applications, including HBM and system-in-package architectures — helping chipmakers meet the growing performance and power demands of the AI era. 👉 Learn more about this milestone from Applied Materials’ official announcement: https://lnkd.in/etzZuSQz Besi Austria GmbH Besi Netherlands B.V. Besi APac (Malaysia) Sdn Bhd BESI Singapore Pte Ltd #Besi #AppliedMaterials #HybridBonding #AdvancedPackaging #AI #Semiconductor #HPC #HBM #Collaboration #BesInnovation