Post by Bechtel Corporation

🚨NEWS:🏗️ Bechtel has been selected by Micron Technology as the engineering, procurement, and construction (EPC) partner for Phase 1 of Micron's leading-edge memory manufacturing complex in Clay, New York. This historic project is planned to become the largest semiconductor fabrication facility in the United States, strengthening domestic manufacturing capacity and helping power the technologies driving the AI era. As Bechtel President and COO, Craig Albert, shared: "This project represents more than the construction of a semiconductor manufacturing campus, it is part of the foundation of America’s industrial future. Micron is making a generational investment in U.S. manufacturing, and Bechtel is bringing its world-class execution to deliver the foundation of long-term technology leadership and economic growth." The project is expected to create thousands of construction jobs and support the development of a highly skilled workforce, delivering lasting economic impact across New York and helping strengthen America’s semiconductor supply chain. 👷 To help bring this vision to life, Bechtel will deploy its integrated EPC delivery model, advanced digital construction technologies, modularization strategies, and world-class project controls — capabilities proven on some of the world's most complex industrial projects. Building a leading-edge semiconductor fab requires precision, scale, and disciplined execution. It's exactly the type of work Bechtel is built to deliver. ⬇️ Learn more in the comments.