Post by AT&S

Name: The devices your customers build are getting thinner, lighter, and more powerful. 🔋 Your PCBs need
Uploaded: 2026-06-16T12:00:25.540Z
Channel: AT&S
Description: The devices your customers build are getting thinner, lighter, and more powerful. 🔋 Your PCBs need to keep up. AT&S’s mSAP (modified Semi-Additive Process) technology achieves line widths down to 2

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The devices your customers build are getting thinner, lighter, and more powerful. 🔋 Your PCBs need to keep up. AT&S’s mSAP (modified Semi-Additive Process) technology achieves line widths down to 20 μm – enabling radically thin circuit boards with optimized high-frequency performance. For procurement leaders, mSAP means fewer layers to achieve the same routing density, reduced material consumption, and smaller form factors that free up space for batteries, sensors, or cameras. Already in production for smartphones, wearables, automotive infotainment, V2X modules, and optical transceivers. 👉️ Discover more about mSAP here: https://lnkd.in/e9H_igRv #oneATS #mSAP #PCBTechnology #Miniaturization #FineLineStructures #SupplyChain

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