Post by ASMPT Ltd

Precision bonding stack: why AI is pulling multiple product lines at once In this issue, we unpack one key takeaway from ASMPT’s Q12026 announcement and discussion: AI-driven architectures are raising backend complexity and demand is showing up across multiple parts of the packaging and connectivity stack. Read about:  ✅ Why precision bonding matters more as interconnect pitch tightens ✅ How to think about the “stack” (Advanced Packaging + Photonics/CPO + adjacent steps) without the hype ASMPT AEi, Inc. ASMPT ALSI ASMPT AMICRA ASMPT NEXX, Inc. ASMPT SEMI Solutions ASMPT SMT Solutions