Post by ASML

This week, ASML joins our peers and partners at one of the key annual gatherings for the semiconductor industry: SPIE Advanced Lithography + Patterning in San Jose, California. With nearly 50 first-author and collaborative papers, we’re presenting innovations from throughout our holistic lithography portfolio. Here are three areas we’re focused on: 🔍 2D scaling with EUV: To keep Moore’s Law alive, we’re delivering unprecedented power from our extreme ultraviolet (EUV) light source and bringing High NA EUV into high-volume manufacturing. 🧩 Innovative chip design: Chipmakers are looking beyond shrink for ways to pack more performance into their chips, so we’re developing hardware and software to enable approaches such as advanced packaging and 3D integration. 🤖 Adding AI: We're finding innovative ways to apply AI-enabled tools to solving chipmakers’ challenges so they can achieve the resolution and pattern yield they need. And that’s just a taste of what we’ll be sharing. If you’re at SPIE, the international society for optics and photonics, make sure to check out our presentations.