Post by ASML

Modern chips rely on a range of materials that not only make up the semiconductor die itself, but also play critical roles in the packaging that shields them and connects them to the outside world. Here are three materials that play a key role in both the microchip circuitry and the packaging that protects it: 💪 Silicon is the foundation that chips are built on because its semiconducting properties are behind transistors’ current-switching abilities. It’s also used for large-area substrates, or interposers, in 2.5D and 3D advanced packaging. ⏳ Silicon dioxide is used to form insulating layers in microchip structures. And, because of its thermal and mechanical properties, it’s also often a primary component of the epoxy molding compound used to encapsulate chips. 🟠 Copper is used for the interconnects that serve as a chip’s wiring, carrying electrical signals to and from transistors. Its electrical and mechanical properties, valued within chips, also lead to its widespread use for chip packaging connections. Together, these essential materials help ensure modern devices meet the demands of today’s technology landscape.