Post by ASML

For patterning the most critical layers in today’s advanced chips, chipmakers need the precision patterning of extreme ultraviolet (EUV) lithography – and they need that patterning to be fast enough to support high-volume manufacturing. With a throughput of 230 wafers per hour, 44% higher than previous systems, the TWINSCAN NXE:3800E is our highest-productivity EUV lithography system. Here are three technical advances that were key to reaching that speed: 💥A higher-power source produces more than 500 W so wafers can be exposed more quickly. 🏎️Faster wafer stages turn that higher power into faster patterning. 🏭Other metrology software solutions and improvements to the system’s mechatronics, including a new wafer handler and faster reticle stage, enable the faster exposure. And we're working hard to build our systems faster, both in the factory and in the field, and expedite delivery so our customers can meet the increased demand in today's chip market.