Post by Amkor Technology, Inc.

The ISIG Executive Summit USA 2026 brought together the full #semiconductor ecosystem for a timely discussion on Advanced Packaging and System Integration for the Next Computing Revolution, spanning foundries, hyperscale, silicon, memory, OSAT, EDA, and deployment. Moderated by Dr. Hamid Azimi (Marvell Technology), the panel featured leaders from across the value chain, including Suresh Jayaraman, Sr. Director of Package Development at Amkor, as well as experts from Intel, Microsoft, Meta, Micron Technology, and Cadence. What stood out was both the breadth of perspectives and the alignment across disciplines. Design, silicon, memory, assembly, and hyperscale deployment were all represented, because next‑generation AI hardware requires this level of system‑level integration. Beyond the stage, Scott Clifford, Sr. VP of Sales at Amkor, engaged with our customers in attendance, sharing insights on advanced packaging strategies, roadmap alignment, and the evolving needs of AI‑driven systems. At Amkor Technology, Inc., we see advanced packaging as the connective tissue that brings these innovations together, enabling performance, scalability, and manufacturability. The future of computing will be built through collaboration across the ecosystem, and conversations like this are how progress happens. 🔗 Learn more about Amkor’s advanced packaging solutions at https://amkor.com. #Amkor #ISIG #AdvancedPackaging #SemiconductorIndustry International Semiconductor Industry Group #Hyperscaling