Post by Amkor Technology, Inc.

Getting strip warpage right is essential for manufacturability and yield in advanced packaging. Gravity is often overlooked in simulations, yet it can skew results unless models match how strips are actually measured on the table. Adding gravity closes the gap between prediction and reality, especially right after flip chip attach (FCA). In Semiconductor Engineering’s sponsor blog, “Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages,” Nathan Whitchurch, Senior Staff Engineer at Amkor Technology, Inc., shows how calibrating a POR model with real warpage data and explicitly modeling gravity and table support aligns simulations with measurements at FCA and post-mold cure (PMC). At Amkor, our packaging and mechanical simulation teams apply stage‑specific models with material densities and contact conditions, then validate against metrology. This helps customers make earlier design‑for‑assembly choices, such as core versus coreless substrates and slotting between blocks, to control warpage better and improve yield. 🔗 Read the full article: https://lnkd.in/geYkxaJF #Amkor #AdvancedPackaging #Warpage #StripWarpage #ProcessModeling #ProcessSimulation #Semiconductors #SemiconductorIndustry