Post by Amkor Technology, Inc.

Amkor Technology, Inc. looks forward to engaging with customers and industry peers at Advanced Packaging International 2026, where leaders will discuss how advanced packaging is strengthening resilient semiconductor supply chains. On April 21 at 2:00 p.m. CET, Eoin OToole, Research and Development Director at Amkor Technology, will present “Supporting the European Advanced Packaging Ecosystem in HVM and Innovation.” The session will highlight how Amkor Technology Portugal (ATEP)—Europe’s largest advanced packaging OSAT—supports Europe‑centric foundry advances through high‑volume manufacturing, a broad advanced packaging portfolio, and Amkor’s Hybrid Panel Technology for die‑first and die‑last fan‑out solutions. As a trusted #OSAT partner in Europe, Amkor continues to invest in advanced packaging technologies that enable innovation and supply‑chain resilience. 🔍 Learn more: https://lnkd.in/ep-9ZNei #AmkorTechnology #AdvancedPackaging #Semiconductors #FanOutPackaging #AdvancedPackagingInternational2026 #SemiconductorIndustry