Post by Advanced Packaging Magazine & AP International Conference

🎥 ‘High-power, high-performance semiconductor packaging design expertise’ Dr Larry Zu, Ph.D., CEO of Sarcina Technology LLC, a global semiconductor packaging specialist, discusses the launch of the company’s AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing for the delivery of cost-effective, customizable and cutting-edge solutions. He also covers advances in Sarcina’s photonic package design capabilities for Co-Packaged Optics (CPO). Click the link to watch🔗 https://lnkd.in/epk9V5Nq #advancedpackaging #APMagazine #semiconductor