Post by Alexia Allison

In the context of increasingly complex AI chip architectures with Advanced Packaging (CoWoS, HBM3e/4) and new process nodes approaching the physical limits (Intel 18A, TSMC N2), having an independent unit with state-of-the-art equipment to "dissect" the physics and analyze the microstructure is extremely important. The Metal Pitch comparison between SMIC N+3 and Intel 18A that they posed in the very first article is proof that STEEL will be the place to answer the most challenging technical questions that businesses never disclose themselves. We eagerly await in-depth technical reports (and free releases) from STEEL so that engineers can have more real-world case studies to analyze. #ICDesign #ProcessEngineering #SemiconductorProduction #HardwareAnatomy