Taiwan
- Coordinate the quality and delivery of automation equipments - Accompany Japan customer audit the sub vendors to confirm the quality of equipment - Advance package evaluation : COWOS, COPOS, FOPLP, CPO material/equipment/market trend study
- Handle CMOS image sensor business unit (totally 300 employee: staffs :100, operators : 200) - Scope : Sale, Quality control/service, New Package Introduction, Equipment maintenance, Process control, manufacture, Planning and Production control. - Responsibility : a. Participate the strategy and KPI target setting b. In charge of business, margin, profit of CMOS image IC package c. Manage the relationship of customer and approach new customers/business d. Handle the customer complaint or quality event e. Leading the engineering team to improve the process of operation and NPI project develop on schedule f. Participate daily operation of factory to make sure all output and quality g. Talent development and train skill of the potential members h. Co-work with other function team for continuous improvement projects
- Handle memory IC assembly business group (totally 1300 employee: staffs :500, operators : 800) - Scope : Quality control/service, New Package Introduction, Equipment maintenance, Process control, Manufacture, Planning and Production control. - Support sale team to approach new business/customers - Responsibility : a. Participate the strategy and KPI target setting b. In charge of business, margin, profit of memory IC c. Manage the relationship of customers and closely co-work with key customers for next generation products develop d. Handle the customer complaint or quality event e. Leading the engineering team to improve the process of operation and NPI projects develop on schedule f. Participate daily operation of factory to make sure all output and quality g. Talent development and train skill of the potential members h. Co-work with sale team to approach new customers/business
- Handle Equipment division of memory IC assembly business group (totally 300 staffs) - Responsibility : a. Achieve the top down KPI goal of assembly business group b. In charge of Equipment maintenance c. Handle the quality event caused by equipment d. Leading the equipment engineering team to improve the process/quality/machine down rate of daily operation e. New equipment evaluation, new tooling vendor evaluation
- Handle Manufacture division of memory IC assembly business group (totally 820 employee : staffs 20, Operator :800) - Responsibility : a. Achieve the top down KPI goal of assembly business group b. In charge of production output and schedule control c. Handle the quality event caused by operator d. Leading the manufacturing team to improve the output/efficiency of daily operation e. 6s of cleaning room maintain
- Die bond/Wire bond process engineers of package assembly - Yield improvement of die bond and wire bond - Customer complaint of die bonding/wire bonding handling