Taiwan
I am a materials engineer specializing in semiconductor packaging, thin-film deposition, and process reliability. I completed my M.S. in Materials Science and Engineering at the University of Michigan (GPA 3.914/4) and my B.S. at National Chung Hsing University, focusing on materials characterization and electronic packaging. At the University of Michigan, I developed kirigami-based smart materials using PEDOT:PSS conductive polymers and machine learning for wearable sensing and robotics. As an R&D intern at TSMC’s Advanced Tool & Module Development Division, I optimized wafer-to-wafer bonding processes using nondestructive infrared and ultrasonic techniques, gaining practical experience in DOE-based process optimization and failure analysis. In October 2025, I joined Prof. Yukihiro Shimogaki’s laboratory at the University of Tokyo as a Cooperative Visiting Researcher, focusing on CVD synthesis of high thermal conductivity thin films for 3D integrated circuits (3D ICs). My previous research at National Chung Hsing University on Cu-Ag nanocomposite pastes and Ag-Pd-Au alloy wires led to two first-author publications in Nanomaterials (2022) and Mater. Sci. Technol. (2023). With academic and industrial experience across the U.S., Taiwan, and Japan, I aim to contribute to advanced semiconductor process development and materials innovation, bridging research insights with real-world manufacturing solutions.
In October 2025, I joined Prof. Yukihiro Shimogaki’s laboratory at the University of Tokyo as a cooperative visiting researcher for two months. My research focuses on the CVD synthesis of high thermal conductivity thin films for 3D integrated circuits (3D ICs). I will investigate AlN-based dielectric films, optimize surface pretreatment and low-temperature deposition parameters, and evaluate interfacial bonding and thermal transport properties using XRD, XPS, and SEM analysis. This project aims to enhance thermal boundary conductance and material reliability in advanced semiconductor packaging. The experience will not only deepen my understanding of thin-film growth mechanisms and process optimization, but also strengthen my cross-cultural collaboration skills in a leading Japanese research environment.
• Focusing on wafer-to-wafer bonding for advanced semiconductor packaging. • Applied nondestructive evaluation techniques (e.g., infrared imaging, nonlinear ultrasonics) to assess interfacial bonding strength and alignment. • Gained practical experience in nanoscale process optimization and failure analysis within a high-volume manufacturing environment.
Worked with Professor to implement lessons following school’s curriculum; “Wafer bonding technology for 3D integration” and “3D and Heterogeneous Holistic System Integration”
Presented research findings regarding the “Compositional effects on microstructure and electrical properties of silver-palladium-gold alloy wires for LED packages” and “Magnetically controllable hollow multi-shell magnetite spheres as SERS substrates for pesticide detection”