Greater Seattle Area
I’m a Ph.D. candidate in Electrical & Computer Engineering at The Ohio State University (May 2026) focused on WBG power/RF devices—especially GaN vertical diodes/MOSFETs and GaN HEMTs. I take devices from first-principles design → TCAD simulation → Layout design → Fabrication → Measurements → Analysis, then close the loop with modeling and reliability analysis. Core Focus - WBG device design and field-management for high breakdown and low Ron - End-to-end cleanroom process integration and yield/debug - Device behavior/compact modeling, reliability and analysis Cleanroom & Process Integration - Full flow ownership: photolithography, ICP-RIE etching, ALD dielectrics, RF sputter, metal deposition, liftoff/anneal, passivation, and inline metrology (SEM, profilometry, ellipsometry). - Termination engineering: beveled mesas, guard rings, JTEs, and field plates; spin-on-glass and high-k stacks (e.g., Al₂O₃/BaTiO₃) for E-field shaping. - Collaboration with MOCVD teams for epi specs (thick, lightly doped drift layers; p/n implants/diffusions; contact optimization). Device Design & Modeling - TCAD (Silvaco Atlas/DeckBuild): doping/geometry sweeps, band diagrams, impact ionization, mobility and trapping models; layout-to-mask translation and design rules. - Analytical tradeoff mapping: Ron–BV curves, BFOM tracking, and termination sensitivity studies to guide material limitation. Measured Results & Impact - Fabricated and characterized > 10-kV-class vertical GaN PN diodes with stable reverse characteristics using engineered terminations and dielectric field management. - Built IV/CV/TDDB/HTRB workflows (B1506A, high-voltage supplies, guarded fixturing) and extracted reliability/recovery behaviors relevant to power converters. Teaching, Mentoring & Communication - Helped build and teach two Intel-supported graduate labs: GaN HEMT fabrication (ECE 5037) and GaN HEMT characterization (ECE 5537). Tools & Platforms - Fab: photolithography, ICP-RIE, ALD, sputter, e-beam/thermal evap, rapid anneal. - Modeling/EDA: Silvaco TCAD, MATLAB/Python, OrCAD/PSpice; data automation/analysis in Python. - Test: B1505/B1506/curve tracer, precision LCR/C-V, high-voltage sources, custom fixtures. What I’m Looking For R&D roles in power or RF semiconductors where I can own the device stack—from design and process integration to measurement, modeling, and reliability qualification. Let’s connect.
Focused on Gallium Nitride based power devices design, fabrication, analysis, and optimization. Used Silvaco TCAD for device design and simulation. Over four years of device fabrication experience in cleanroom. The fabricated vertical GaN PN diode achieved the highest breakdown over the world.
Developed two graduate level semiconductor lab courses, ECE 5037 and ECE 5537. Teaching assistant for ECE 5037, GaN HEMT fabrication lab. Teaching assistant for ECE 5537, GaN HEMT Device measurement and characterization lab. Both lab courses were funded by Intel. Official certification can be obtained by taking these two courses.
Used Orcad PSpice to design a new generation of 360° home camera product. Used Orcad PCB Designer to convert the designed schematic to PCB board for manufacture.