Yash Verma

Physical Design Engineer at Apple Inc

United States

About

• Physical Design/Implementation engineer with 7 years of experience in RTL to GDSII implementation of UCIE/HBM testchips and high-performance CPU cores, timing analysis, physical verification, IR analysis and high frequency clock distribution. • Testchip Lead responsible for driving successful tapeouts of UCIE/HBM testchips across multiple technology nodes. • Expertise in synthesis, floorplanning, placement, clock tree synthesis, routing, timing closure, EMIR, and physical verification. • Expertise on tools like Fusion Compiler, ICC2, Prime Time, ICV, StarXT, Design Compiler, Redhawk and Calibre.

Experience

  • SoC Physical Design Engineer at Apple
    Sep 2024 - Present · 1 yr 11 mos

  • Synopsys Inc (Ottawa, Ontario, Canada)
    • Staff Physical Design Engineer
      Feb 2024 - Sep 2024 · 8 mos

    • ASIC Physical Design Engineer, Sr I
      Nov 2020 - Feb 2024 · 3 yrs 4 mos

  • AMD (2 yrs 10 mos)
    • Sr Silicon Design Engineer
      Jul 2020 - Oct 2020 · 4 mos

    • Silicon Design Engineer 2
      Jan 2018 - Jul 2020 · 2 yrs 7 mos

  • ASIC Design Engineer 1 at Open-Silicon, Inc.
    Jul 2017 - Jan 2018 · 7 mos