Taichung City, Taichung City, Taiwan
Quality Engineer with 6+ years of experience in semiconductor and advanced manufacturing environments, specializing in supplier quality management, defect analysis, SPC monitoring, and cross-functional technical problem solving. Experienced in handling complex manufacturing and supplier-related quality issues through data-driven analysis, SPC monitoring, and structured troubleshooting methodologies. Proven ability to drive continuous improvement, reduce recurring defects, and align cross-functional stakeholders under high-pressure production environments Strong background in customer communication, escalation management, and quality system execution, with hands-on experience in semiconductor process troubleshooting, manufacturing risk assessment, and repair validation activities.
• Managed escalated non-conformance and supplier quality issues involving coating systems, mechanical assemblies, electrical components, and field reliability concerns in offshore wind nacelle manufacturing • Reduced supplier-related non-conformance cases at the Hub production station by approximately 40% through structured NC trend analysis, escalation management, and strengthened cross-functional quality alignment • Led cross-functional troubleshooting discussions with suppliers, manufacturing teams, SQE, and technical engineering teams to define containment actions, repair strategies, and long-term corrective actions • Supported supplier qualification and repair validation activities for manufacturing rework processes, including risk assessment and process documentation alignment • Drove defect trend analysis and recurring failure mode review to identify systemic quality risks and improvement opportunities • Acted as certified trainer and SAP key user for factory quality documentation and serial number management processes
• Managed complex repair activities for escalated manufacturing defects transferred from upstream production stations during final blade manufacturing stages • Evaluated repair feasibility and coordinated customer-approved repair methodologies for structural, bonding, painting, and surface quality defects under delivery schedule constraints • Led customer final walkthrough inspections and shipment quality verification, identifying and resolving cross-process quality issues before blade delivery • Supported on-site defect verification and repair execution at project assembly sites (PA sites), coordinating repair teams, technical documentation, and customer communication • Investigated composite leakage and bonding-related quality issues during structural assembly and bonding processes, supporting root cause analysis and repair strategy definition • Acted as key quality interface for global Tier-1 customer Vestas, driving cross-functional issue resolution through data-driven analysis and stakeholder alignment
• Owned quality and yield improvement activities for N7 Cu seed PVD production in high-volume semiconductor manufacturing • Improved copper loss defect-free rate from 89% to 92% and line broken yield from 97% to 99% through defect trend analysis, SPC monitoring, and preventive maintenance optimization • Developed chamber-level defect localization methodology by correlating wafer routing history, chamber particle data, defect mapping, and hardware lifetime records • Identified strong correlation between line broken defects, target lifetime, and chamber arcing behavior, leading to proactive target replacement and preventive cleaning strategies • Prioritized high-risk chambers through systematic defect analysis and coordinated targeted maintenance actions with equipment teams to reduce repeated particle-related excursions • Supported cross-functional troubleshooting of process excursions while balancing defect reduction and production throughput requirements