Styria, Austria
• Internationally recognized expert for high-speed digital and mixed-signal test and measurement, signal and power integrity, and jitter analysis • Consistently rated by all my managers as one of my employer's top performers • 20+ years of experience in high-end semiconductor test & measurement; prior to that, 7 years as a freelance software developer and in parallel 4 years in research (experimental physics) • Proven track record as a team leader for complex instrument developments and test and characterization projects • Author and co-author of two test & measurement books (see below); several publications in peer-reviewed journals; peer-reviewer for IEEE • Developed and taught numerous tutorials about high-speed design & test and about timing & jitter at international conferences, and multi-day seminars in cooperation with universities in Europe • Used to interacting with customers as well as vendors • I constantly challenge myself in order to acquire new experience and skills, and also love to teach and mentor others. • Fluent in English, German and French, basic knowledge of Spanish • Used to working in multicultural environments; extensive international work experience. Specialties: - Test & measurement of high-data-rate / high-frequency signals up to 40 GHz, and high-power components in the kA / kV range - Instrumentation and automated test system design - Design of complex bench test setups, custom test equipment, and test fixtures - Benchtop characterization of analog and mixed-signal ICs and circuits - Signal and power integrity, EM modeling - Jitter measurement and analysis - PCB design - Software development - Embedded design - Project lead / project management - Technical presentations - Teaching and mentoring
Heading the test development engineering team of the business unit ATV PS (Automotive Power Integration and Supply) at the design center Graz: Management of a group of approx. 16 test development engineers with a multi-national background. Test package development (test concept, test program, test hardware), supporting production test (wafer test and package test), qualification and production ramp-up, test cost reduction. Driving cooperation across Infineon development and production sites as well as with external consultants.
Advanced Packaging Business Unit, backend test of semiconductor devices and printed circuit boards with embedded active and passive components. Specification, vendor selection, installation, qualification and ramp-up of an integrated semiconductor test cell. Lead and supervision of test concept and test package development in cooperation with customers and outside vendors. Close alignment and involvement with internal characterization and prototype test lab. Cooperation with manufacturer of automated printed circuit board test equipment to provide enhanced test capabilities.
Part of Infineon's "Test and Handling Automation" department, serving internal customers across development and production sites in Europe and Asia. Architecture, design and development of customized, proprietary test hardware and software solutions for in-house semiconductor test applications (power semiconductors and modules, sensors & sensor modules, RF semiconductors, small ICs, discrete components). Internal as well as partially outsourced development. Project management, subcontractor selection and supervision. Project-based training, mentoring and technical supervision of students and new hires.
Benchtop characterization of high-speed analog and mixed-signal ASICs. Signal and power integrity, high-frequency measurement techniques, design of test equipment, printed circuit board design; training and mentoring of fellow engineers.
Leading a group doing the benchtop characterization of Teradyne's high-speed analog and mixed-signal ASICs. Consulting on signal integrity, high-performance PCB design, test fixtures, board-level circuit design, high-frequency measurements, electromagnetic modeling.
Benchtop characterization of high-speed analog and mixed-signal ASICs. Signal integrity, high-frequency measurement techniques, printed circuit board design; training of fellow engineers.
Electrical failure analysis, stress and reliability testing of DRAM chips. Job Location at IBM Corbeil-Essonnes (later Altis Semiconductor, then X-Fab France SAS), France.