Wee Keong Tee

TECHNICAL PROJECT MANAGER

Singapore

About

Executive Summary: Working for 20 years in GE Aviation and Hewlett Packard knowledgeable Staff Engineer with strong background as TPM for NPI projects. Trained and capable professional focused on driving complete end to end delivery for a NPI project. Experience to drive cross-collaborations between teams to handle difficult situations. As a project lead in delivering major cost saving, new product development and commissioning new engine compressor manufacturing capability, the key challenges are to remind vigilant, resourceful and mindful of customer needs. Stakeholder review arranged to align expectation, raise alert for potential road block, and track actions with timeline and milestones. Completed WSQ course for Specialist diploma in Supply Chain Management and Precision Engineering (Additive Manufacturing) as a continuous learning attitude. As a team lead, I am required to be independent, resourceful and to make critical decision in resolving quality issues across functional teams. This has helped me to develop my leadership, decision making, analytical troubleshooting, project and team management.

Experience

  • Technical Project Manager at Dyson
    Jun 2021 - Present · 5 yrs 1 mo

    Drive and Lead New project introduction from UK to mass production in across dyson manufacturing isites across the world Lead cross functional teams from Operations, Molding, Manufacturing, Procurement to resolve issues, identify project risk, mitigation Arrange technical phase reviews with Prject Stakeholders on critical project milestone throughout the project life cycle.

  • Staff Engineer (NPI) at GE Aviation
    Jun 2011 - Jun 2021 · 10 yrs 1 mo

    1. Ensured smooth transfer and transition of new NPI products to operations. Track project milestones and deliverables and potential risks/crisis. 2. Drive and met NPI project milestones with cross functional teams to industrialize GE90-115B & GE9X engine compressor vane sector manufacturing capability, ramp up capacity in Singapore yr 2014 & 2015. Total 12 SKU. Production ramp 3400pc capability 3. Drive operational process & productivity improvement to reduce non-conformance rejects, reduce cycle time TAT, specification, improve manufacturing yield 4. Led a team of engineers to achieve $3.3M cost reduction on 2015 through manufacturing process optimization, reduction of consumable cost, productivity improvement, qualification of alternate direct material, reduction of manufacturing cost. 5. Collaboration with Material Suppliers for material cost reduction projects such as Air foils and Honeycomb seals. Achieved USD$300K savings through substantiation of alternative material sources. Provided Coaching, mentor-ship to motivate and supervise direct reports and team members.

  • Principle Product Integration Engineer at HP
    1996 - 2011 · 15 yrs

    PRINCIPLE QUALITY & PROCESS INTEGRATION ENGINEER HEWLETT PACKARD SINGAPORE - Singapore - May 1996 to July 2011 (1) NEW PRODUCT INTRODUCTION: • Launched new business development project code named "Decaf". Partnership with Outsourced FAB and Hewlett-Packard R&D hub to ensured smooth production ramp. • Cost avoidance of $1.2M in investing on new machinery and transferring of older technology by redesigning new manufacturing process work flow. New design able to capitalize on existing technology and able to integrate into existing install based without affecting customer experience. (2) LEAN SIX SIGMA: • Awarded Silver medal for conducting DOE (Design of Experiment) in improving the reliability of testing probes. Reduced Mean-time-to-failure from ~3months to ~9 months. • Involved in ISO9000 audits for ensuring a systematic system structure setup to establish clear responsibility and accountability, analyze and measure of the capability of key activities, Identify the interfaces of key activities within and between the functions of the organization. (3) SUPPLIER MANAGEMENT: • Ensure external wafer supplier quality control be deploying quality key performance matrix to monitor yield, critical product parameter cpk, incoming inspection for defects. (4) R&D: • Capitalized on CFD (Computer fluidic development) simulation to predict the optimal thermal turn-on energy of the inkjet resistors. Optimized ink droplet by characterizing the wafer thin film layout that forms the firing resistor. (5) COMPETITOR ANALYSIS & PATENT • Participated in strategic management for assessing business opportunity working with Taiwan clone cartridge manufacturer. Involved in the technical and business assessment on the supplier capability profile. Visited supplier on-site for assessing technical capability.