Kulim District, Kedah, Malaysia
Process Engineer | Semiconductor (PCB & IC Substrate) | 4+ Years Experience Experienced in startup project, tool and process qualification, process optimization, cost-saving and high-volume manufacturing. M.Sc. in Electronic Engineering (Mechatronics) with a strong foundation in robotics and system integration. Focused on solving complex engineering challenges and driving continuous improvement in semiconductor production.
• Coordinated production layout planning, manpower allocation, and magazine flow optimization. • Supported tool move-in activities and route planning in collaboration with cross-functional teams during start-up plant commissioning. • Served as tool owner, managing daily quality excursions and conducting Design of Experiments (DOE) to identify and implement improvement plans for sustaining tools (Adhesion Promotion Rinse and Post ALP Cleaning). • Led Process Qualification for new N+1 tool (second and third Adhesion Promotion Rinse tools) to support capacity expansion. • Managed QMS documentation for wet line processes, including Process Instructions, Work Instructions, Organized Reaction Plans, Daily Checklists, and Production Qualification documentation. • Conducted operator and technician training and qualification to ensure production readiness and compliance. • Applied RCCA/PA, Six Sigma and PFMEA to drive continuous process improvement and enhance product quality.
• In charge of start-up Drilling Module and involve with a cross-functional team in commissioning new machines such as mechanical drilling machine for through hole drill, X-Ray Drilling machine for hole alignment drilling, Nexiv machine for pitch distance monitoring, Hole Analyzer machine for hole condition monitoring, Hyper Quick Vision machine for line width and pad diameter monitoring and bake oven for material preparation. • Monitoring modifications, upgrades, and troubleshooting existing processes and ensuring all related process complies with control regulation’s standard. • Liaise with vendor/supplier and provide all associated items complies the updated specification. • Create process control standard, process standard, temporary work instruction (TWI), establish Operation Manual Operation Instruction (OMOI) and ensure all engineering related documents are up to date.
An IPC CID (Certified Interconnect Designer) Basic Serial No: CID-22022535694 • Introduction to PCB Manufacturing • Electronic (IC) Packaging Overview • Performed web-based PCB Design technology CAD tool (Autodesk EAGLE) • Handling Moisture and Lead-Free Electronics • ESD Control and Awareness • Design for Assembly and Design for Testing • Exposure to Business Communication • Introduction of IPC 600 & 610
Conducts research on the development of gesture-controlled robotic arm for upper-limb hemiplegia patients.
• Planning and scheduling of aircraft maintenance tasks and organising manpower shifts. • Record and ensure that all maintenance data is controlled and up to date. • To verify that the necessary manpower, materials, equipment and tooling are made available when required.
• Write, attend and responds to incoming calls, emails, letters, quotations and invoices regarding customers' inquiries and office's needs. • Keeping track of documentation of staffs and internship students (Human Resource). • Involved in event managing.