United Kingdom
Hi, I’m Wai Keat — a Year 3 MEng Electrical & Electronic Engineering student at the University of Nottingham. I actively seek to apply my academic knowledge through hands-on projects and internship experiences focused on factory automation, robotics integration, and smart manufacturing systems. I’m enthusiastic about exploring innovations that bridge engineering theory with real-world impact and am always open to opportunities that push the boundaries of intelligent automation. Lets connect!
• Designed and prototyped a 3D-printed casing for the Wire Bond Control Tower in Fusion 360, enabling 1 operator to manage 32–64 machines and reducing alarm clearance time by 50% (90s → 45s). • Compiled BOMs and CAD layouts for >15 hardware ports (USB, HDMI, RJ45, RS232), improving design scalability by 30% for future upgrades. • Collaborated with engineers, IT, and procurement teams to set up and integrate 16 wire bonding machines, resolving LAN/VNC issues and improving remote access reliability by 40%. • Gained hands-on experience in CAD modeling (Fusion360), MES automation, manufacturing optimization (CAMSTAR, KVM, VNC), process optimization (FTA, Fishbone) and web developments (HTML, CSS, JS).