Reutlingen, Baden-Württemberg, Germany
• Development of power semiconductor modules for automotive applications • Wide-bandgap semiconductor packaging and application
• Group leader of the R&D team for power semiconductor packaging • Development of new technologies and new products • Technology and product roadmap for IGBT modules: definition and implementation • Leading a task force to resolve early field failures using 8D-KT method
• Management of the department Process-Engineering including the teams assembly and testing • Industrialization of manufacturing processes for IGBT modules • Capacity planning of the production, investments in new production machines
• Yield engineering for power semiconductor packaging
• Process specialist and yield manager for delivery systems • Study on IT system architecture for manufacturing data integration
• Development of new DRAM memory chip technologies • Technical management of the product engineering team in the 65nm development • Design of experiment (DoE), statistical data analysis, evaluation of process experiments • Root cause analysis of failures, compilation of failure pareto