Klagenfurt-Villach Area
In my professional career I enjoy taking up tough challenges and stepping in the lead to solve them. Project- and Task-Force (TF)-leads up to date were … • Development of SiGe-Hetero-Epitaxy for Nano-Electronics Devices with focus on Delta-Doping for 2-DEGs and local growth techniques for defect-free relaxed buffer layers. • 150nm/256Mb Trench-DRAM Development Lead-Engineer including test-site design with successful qualification of Infineons first 256Mb/150nm Trench-DRAM technology. • BCD (Bipolar-CMOS-DMOS) Transfer & Conversion including BCD Development and Qualification of Infineons first 0,6µm BCD-Technology B6CAD. • High-Temperature Processing TF-Leader in furnace and epitaxy to enable Power Technologies for bigger wafer diameters in 8-inch and beyond. • Development Project-Lead of Laser-Backside-Annealing for thin wafer processing to enable IGBT/Diode power technologies in 8-inch and beyond. • Super-Junction-MOS-FET Yield-Enhancement TF-Lead. • Understanding assembly challenges like Pick-Up and Bonding as well as MEMS devices by applying High-Speed-Imaging (HSI) techniques for analysis. • Transfer and development of HiRel Trench-MOS and GaN-HEMT Devices for space applications. IEEE Senior Member, published 25 technical papers and holding 24 patent families.
Section Head and Team-Lead for Epi, Substrates and Interfaces
Team- and Transfer-Project-Lead for High Reliability Discrete Power Products for Space Applications including Development for Si-MOS-FET and GaN-HEMT
Leading Process Integration and Product Engineering Teams for High-Voltage IGBTs, Diodes
Process Integration Engineer Mid of Line Module DRAM Development. Test-Site design and coordination for 150nm groundrule DRAM.
PhD Thesis "Si-Ge Heterostructures and Devices for Nanoelectronics"
Nanoelectronics (PIN Diodes, vertical MOS-FETs, Delta-Doping for 2DEG, local SiGe growth) SiGe Hetero-Epitaxy, Heterostructures, Superlatices, Molecular Beam Epitaxy Semiconductor processing (Epitaxy, Doping, Litho, etch, Deposition) Physical characterization (SEM/TEM, AES/SIMS/EDX, STM/AFM, RS, PL) Electrical characterization
Ferro Electric Liquid Crystals Displays (LCDs) applying monolayers for LC alignment