Kedah, Malaysia
• Managing a team of 11 engineers and 4 Assistant Engineers in inline fast feedback for excursion prevention and scrap reduction due to defect density topics • Lead Defect reduction activities, Cross Functional Teams and projects using DMAIC approach. • Accomplishments: Reduction Poly Deposition particles by 30% resulting in 3% yield gain. Successful cassette particle reduction project. Annual savings of RM40,000 per year. Process flow optimization to reduce corrosion on wafers due to cassette.
• Technical expert and process owner for Etch, Litho and CVD processes. • Perform in-depth defect analysis (commonality, failure analysis, statistical analysis, kill ratio and partition studies) for fast feedback and to minimize exposure due to defect density topics. • UMD (Unit Module Development) team Responsible for the success of new device ramp up, process transfer/ development and inter-fab transfer/ development Detect potential major defectivity issues during initial development phase and implement containment, process optimization and finalized solution before full ramp. Execution of lithography PWQ (Process WIndow Qualification) to check process margin for new technology development using brightfield/ darkfield scan strategy • Accomplishments: Resolved Bondpad Chlorine Particles issue through SMIF pod dedication. Concluded root cause-stage of 4 year old elongated defects issue causing line signature yield loss. Resolved small defects issue causing yield loss on thru implementation of Backside Etch thus gaining 4-5% yield. Improved HDP particles (Median by 2 counts and 90 percentile by 9 counts) through Continuous Improvement Plans involving Gate Valve Assembly Improved Test Wafer OOC rate by 84%, Metal Bridging 90 perc by 60% & Monthly Ave. Yield by 1.1% through implementation of MIM Etch dedication on Metal Etchers.
• Managed 22 Shift Process, Equipment and Manufacturing Technicians in giving fast feedback and minimize exposure and excursions due to defect density topics as well as maintaining equipment uptime and perform corrective actions on equipment issues. • Managed uptime and tool utilization for all ILM tools; brightfield, darkfield, E-Beam and unpatterned wafer inspection system, optical and SEM review stations • Process owner for C18 technology and Thin Film Dielectrics/ Implant area (2004-2005) • Accomplishments: Successfully managed Silterra Ramp Up 2006 : installation, hook up and production release for Ebeam, Brightfield, Darkfield, Unpatterned Inspection system and Optical Microscope. Successfully managed ILM Tool Centralization Project 2006. Designed and developed Excel/ Visual Basic/ Klarity macros; (i) Execute daily reports for lots on hold, forecasted arrival of lots and cycle time calculation. (ii) Automatically plots weekly SPC charts for technology/ process owners. (iii) Automatically plots defect trend vs process tools for process owners.
• Process owner for Philips 0.25um and 0.14um technology (2001-2004) doing defect analysis on defect topics to determine root cause, drive preventive action and prevent excursions • Managed uptime and tool utilization for all defectivity tools brightfield, darkfield, optical and SEM review stations (1999-2001) • Technology transfer cum training, Philip, Netherlands, Aug 1999 to May 2000 • Accomplishments Successfully managed SSMC Equipment Fab Start-Up for all defectivity tools in May 2000. Active Block Etch Team : successfully found root cause to circular active block etch and worked together with Etch to implement preventive action. Yield Improvement Team : achieved 42% defect reduction of Active Extra Pattern