Stephane Emery

Head of System-on-Chip at CSEM

Zurich, Switzerland

About

Experienced manager with a demonstrated history of working in the research and development industry. Skilled in International Project Management, Embedded Software, Customer Acquisition and Application-Specific Integrated Circuits (ASIC). Strong business development professional with a MBA focused in International Management from University of Geneva.

Experience

  • Group Leader at CSEM
    Mar 2014 - Present · 12 yrs 5 mos

    Leading the SoC (System on Chip) & Mixed Signal Design group in Zürich.

  • Co-founder, CTO and Project Manager at Innodul AG
    Jan 2009 - Feb 2014 · 5 yrs 2 mos

    Co-founder, Member of the Board and R&D Manager. Innodul focuses on the development of high-speed POF (Plastic Optical Fiber) communication systems and on the development of integrated circuits (ASIC). - Relation with investors, external partners and customers - Project Leader - System Architect: customer requirements, product specification, architecture definition - Technical activities: OFDM, DSP, C++, embedded software, Matlab, PCB design, VHDL, analog and digital simulation, metrology, Ethernet, Optical communication, ... - Product development, evaluation and certification: optical transceivers, Gigabit Ethernet switches, ...

  • System Development Group Leader at DSP Group (DSPG)
    Oct 2006 - Dec 2008 · 2 yrs 3 mos

    Leading the System Group with teams in Germany, Switzerland and Israel: responsible for product definition, chip specification and applications for Cordless and IP Terminals. Program Manager for DECT chips (cordless telephony).

  • System & Customer Support Group Leader at NXP
    Oct 2006 - Sep 2007 · 1 yr

    Leading the System Group (product definition, specification, applications) and the Customer Support Group. Program Manager for DECT chips (cordless telephony). The whole Business Line was acquired by DSPG in September 2007.

  • Group Leader at TranSwitch Corp.
    2000 - Oct 2006 · 6 yrs 10 mos

    Development of integrated circuits for high-speed telecom applications (IP, SONET, ATM, E1, T1, HDLC, ...) Project leader of international projects with teams in India, USA, France, Switzerland, ...