Taiwan
- Responsible for product spec planning, contract/RFQ/MRD/SOW negotiation and closure, supply chain readiness, issue resolution and qualification. - Familiar with the IC design flow; led cross-functional engineering (SOC, DV, FW, PE, QA) collaboration across PCBA, firmware, validation, qualification, and reliability. - Proven experience collaborating with tier-1 semiconductors and 11 ODMs/OEMs. - Led SSD-related silicon and module projects, achieving a 3-month acceleration ahead of target. - Performed Data analysis through Python and PowerBI and introduced Jira dashboard management - Key Deliverables: 。PCIe4.0 Dramless Flash Controller - PS5019T 。Micron M2450 dramless TLC SSD 。Micron M2500 dramless QLC SSD
- Acted as main contact to lead qualification of NPI product, proven experience working with Dell, HP and partnerships with major tier-1 CPU suppliers AMD. - Familiar with the OEM/ODM hardware product development cycle, including NPI , mass production processes, and RMA. - Deliverables: 。 Alienware Aurora R8 (Intel platform) 。Alienware Auryzen Edition (AMD platform)