Bengaluru, Karnataka, India
8.0+ years Experience in FATP & Camera module Failure analysis , Working as a Engineer - FATP & Camera module assembly section in FOXCONN , hands - on Experience on top Smartphone mobile brands like Apple - iPhone - MI,Redmi mobile manufacturing unit Samsung, Oppo, Vivo, Apple - I phone camera module manufacturing unit . 3.5 years experience in mobile Failure analysis and mobile manufacturing. 3.7 years experience in Camera failure analysis and Camera manufacturing. 1.9 years experience in I- I-Phone(R&D) Failure analysis on camera module NPI products .
Led failure analysis of camera modules using correlation studies, boxplots, and CPK analysis to identify root causes of performance degradation. Performed root cause analysis on process and design-related failures, driving corrective actions that improved manufacturing yield. Investigated VCM actuator failures by analyzing lens movement stability and electrical response, identifying root causes such as mechanical wear, coil short, and driver IC issues. Utilized advanced analytical tools (X-ray, SEM/EDX, VI curve tracing, thermal/electrical characterization) for defect isolation and mechanism identification. Collaborated with design, process, and reliability teams to implement corrective and preventive actions (CAPA), ensuring long-term process stability. Utilized statistical methods and data visualization (boxplots, correlation mapping) to detect patterns in failure modes and accelerate problem resolution. Conducted CPK analysis on key process parameters to assess process robustness and reduce variability. Prepared detailed failure analysis reports for internal teams and customer communication, highlighting root cause findings and improvement plans. Perform rapid root cause analysis for issues that are seen in the field and during product development and test phases. Collaborated with design, optics, and process teams to implement corrective and preventive actions (CAPA), reducing recurrence of critical camera failures. Supported reliability testing(thermal cycling, drop, vibration) to evaluate camera module robustness and identify weak points in design and assembly. Authored failure analysis reports on camera performance issues, presenting root cause findings and recommended design/process changes to stakeholders and customer. Analyzed electrical and mechanical defects including solder joint cracks, corrosion, delamination, and package-level defects, providing detailed mechanism identification.
Conducted CPK analysis and statistical monitoring of key process parameters to ensure process capability and reduce variability. Drove root cause analysis (RCA) and implemented corrective actions, improving yield and reducing recurring defects. Analyzed electrical and mechanical defects including solder joint cracks, corrosion, delamination, and package-level defects, providing detailed mechanism identification. Supported customer returns analysis (RMA) by investigating field failures, identifying systemic issues, and driving closure with cross-functional teams. Partnered with design, reliability, and supplier teams to align process improvements with failure insights, ensuring long-term robustness. Automated data analysis workflows (Python/Excel/Minitab) to accelerate detection of anomalies in high-volume test data. Prepared detailed process and FA reports for internal stakeholders, summarizing findings and recommendations. Investigated product failures in camera modules (VCM instability, image quality degradation, sensor/lens defects) using correlation and boxplot analysis. Understanding the Customer/Product Specifications to create & develop necessary documents/Work instructions for the assemblies. Conducting regular CFT/NPI meetings to ensure communication between all departments regarding the project progress. Review and Controlling the Release of all NPI related documents.
Supported new product introduction (NPI) by evaluating design for manufacturability (DFM) and conducting early failure mode analysis (FMEA). Performed failure analysis on mobile device components (camera modules, PCBs, displays, connectors, batteries) to identify root causes of defects in production and field returns. Utilized advanced analytical tools for defect isolation and mechanism identification. Drove yield improvement initiatives by analyzing inline defect data, identifying process weaknesses, and implementing solutions that improved yield. Supported customer returns analysis (RMA) by investigating field failures, identifying systemic issues, and driving closure with cross-functional teams. Contributed to continuous improvement of FA methodologies, optimizing test flows and reducing analysis turnaround time. Analyzed electrical and mechanical defects including solder joint cracks, corrosion, delamination, and package-level defects, providing detailed mechanism identification.