Zurich, Switzerland
Electronic Engineer with a wide range of experience (system design, image sensors, high speed data, etc.). Strong in interdisciplinary projects, complex PCBs and design for manufacturing. PCBs with HDI (Altium Designer, Mentor Graphics PADS, Spice, KiCad) Experienced in Altium A365 cloud platform for EDA library, design and production data management (product lifecycle) EDA library management systems with SQL database Multi Gigabit Transceiver routing (>25 Gbps) Electronic/Optoelectronic System Design Analog circuits (filtering and signal conditioning) Voltage Converters Digital Signal Processing Image Sensor Characterizations High speed laser and LED illuminations FPGA (Xilinx, Altera, Lattice, VHDL, Verilog, Modelsim, ActiveHDL) Co-design of ECAD and MCAD, virtual prototyping, rapid prototyping Microcontroller (STM32, ARM, PIC, 8051) DSP (TMS320C6xx, Blackfin) Matlab/Octave R&D Project Management
Next generation product electronics system design, schematic and PCB implementation. Mechanical integration concept. Design for EMC and manufacturability. Solving EMC/EMI problems in existing electronics units and redesigning with improved layout. EMC/EMI measurements for certification with external lab. Successfully transitioned to A365 cloud PDM/PLM solution for EDA libraries, design data and manufacturing data. Introduction of design and quality processes. Design release management and reviewing processes and tools.
High-end FPGA/SoC modules and base boards with transceivers up to and beyond 25 Gb/s. EDA library management system, design release process tools, schematic and PCB design, qualification and validation procedures, signal routing characterization using TDR.
New time-of-flight 3D camera platform: System design for low cost, mechanical and thermal concepts, embedded software design, sensor control logic, design for production and testing. Testing electronics and firmware for mass-production wafer-probing.
Electronic and system design and implementation for 3D cameras with time-of-flight (array lidar) technology for industrial applications. Development of a platform for sensor characterization, testing and wafer probing. FPGA design and coordination with external production partners.