Albany, New York, United States
Semiconductor metrology leader with 20+ years of experience in materials characterization, in-line process control, and advanced semiconductor manufacturing. As CTO at Laser Thermal, I am focused on advancing pump-probe metrology for semiconductor R&D and manufacturing, including characterization of thin films, interfaces, and material systems where thermal properties are critical to device performance, reliability, and scaling. My broader metrology background spans leading-edge logic, nanosheet/GAA devices, chiplets, advanced packaging, EUV patterning, overlay, dimensional metrology, materials metrology, and fab contamination control. I have worked extensively across optical, X-ray, spectroscopic, surface, and chemical characterization techniques, translating complex measurement capabilities into practical solutions for process development, and manufacturing control, often with a strategic focus on lab-to-fab transitions. Previously at IBM Research, I led and grew semiconductor metrology teams, developed metrology strategy for next-generation technology nodes, managed 300 mm in-line metrology toolsets, and partnered with equipment suppliers, researchers, and manufacturing teams to solve critical measurement challenges. Author/co-author of 80+ journal articles, 125+ conference contributions, 20+ US patents and applications, and 3 book chapters. IBM Top Performer 2020. SPIE Senior Member. Editorial Board Member. Specialties: • In-line metrology: OCD/scatterometry, ellipsometry, Raman, HR-XRD, XRR, XPS, XRF, SIMS, AFM • Overlay metrology and advanced process control • Thermal metrology for semiconductor materials and devices • Materials characterization for advanced logic, chiplets, and advanced packaging • EUV lithography and advanced patterning • Fab contamination control: particles and metallics • Mueller matrix ellipsometry • ALD with in-situ ellipsometry process control
Leading technology strategy for Laser Thermal’s metrology platforms, with a focus on semiconductor-relevant materials, devices, and manufacturing applications. • advancing pump-probe metrology solutions for logic, memory, packaging, and power electronics • translating semiconductor R&D and manufacturing metrology requirements into product, application, automation, and data-analysis roadmaps • connecting thermal property measurements to materials selection, device performance, process development, thermal model validation, and reliability challenges • working with customers, partners, and internal teams to expand the role of thermal metrology in advanced semiconductor development and lab-to-fab workflows
• leading and growing a team of 13 engineers and technicians • pioneering lab-to-fab transitions and delivering innovative in-line solutions • roadmap development and capital procurement • in-line dimensional and material metrology, fab contamination monitoring (particles and metallics)
Technical Lead for Metrology Research and Development IBM Research Semiconductor Technology Research AI Hardware Center
• next generation metrology research and development
• overlay and alignment metrology research and development for EUV lithography patterning • scatterometry OCD model development for advanced technology nodes
• temperature-dependent generalized ellipsometry on functional oxide and nitride thin films • spectroscopy instrumentation development • consulting and supporting a start-up company to secure research and venture capital funding • lab and infrastructure management and maintenance • providing solutions and service to external users • supervise and educate graduate students; train employees; hold seminars on ellipsometry
• THz to VUV generalized ellipsometry on complex nanostructured thin films • exploiting sculptured thin films as highly sensitive bio-chemical sensors • in-situ monitoring of sculptured thin film functionalization by means of ALD • in-situ monitoring of Li intercalation in Si nanostructures for battery applications • octupole vector-magneto-optical ellipsometry of ferromagnetic nanostructures • optical model development for complex nanostructured surfaces • lab management, student mentoring and supervision, and operator training
• established glancing angle electron-beam deposition and fabricated three-dimensional nanostructures (sculptured thin films) • Mueller matrix and magneto-optical ellipsometry on anisotropic sculptured thin films • developed optical analysis algorithm for determination of the full dielectric response of sculptured thin films with arbitrary geometry • teaching and mentoring undergraduate students • SEM, AFM, XRD, TEM, …