San Francisco Bay Area
Innovative Senior Technical Product Manager with 10+ years of experience building bridges between customers, business units, and technology teams—delivering superior products that meet complex goals and objectives. Analyze plans, systems, and contracts, mitigating risk through exemplary planning and communication. Senior Technical Product Manager | Senior Data Scientist Email: [email protected] Define product roadmaps, strategy, and functional requirements, monitoring projects through testing, completion, and launch. Troubleshoot and resolve technical and logistical issues, introducing various DL networks to detect and classify yielding anomalies. Translate customer process limitations into technological solutions, optimizing performance utilizing Scrum based Agile methodologies. Background in improving revenue, enhancing customer experiences, and building successful teams. Expertise includes big data analysis, semiconductor processes, image processing, computer vision, machine learning, and deep learning, as well as SQL, Spark, and ML techniques. CORE COMPETENCIES: • Product Management • Customer Management • Data Science • Scrum and Agile Methodologies • Project Management • Semiconductor Processes • Technological Solutions • Revenue Improvement • Product Roadmaps • Usability Testing • Functional Requirements • Team Leadership ACCOMPLISHMENTS: ~Led multi divisional team to develop wafer inspection products; worked with customers for successful product delivery, improving revenue two-fold. ~Developed design based inspection product that fetched multi-billion dollar business for the company. ~Worked with customers world-wide to understand their tools and process related issues, translating them to produce superior technological products. ~Developed products using various technologies, with deep understanding of IP, CV, ML. ~Granted 14 patents and recognized for 11 accredited papers. Please contact me at (408) 476-4384 with any Senior Technical Product Manager and Data Scientist opportunities.
KLA is a semiconductor yield management company with over ten thousand employees worldwide, specializing in developing and manufacturing process-control and process-enabling solutions that accelerate tomorrow’s electronic devices with approximately $5.3B in annual revenue. Define roadmap and managed a cross divisional team to develop and deliver the latest wafer inspection product. Analyzed logistics and data provided by clients to verify profitability and the ability to deliver on client expectations. On boarded solution with internal operations teams, ensuring a complete understanding by all. • To improve reliability of the tool’s anomaly detection, symbiotically combined products from two divisions that led to 2x predictable and reliable detection and classification. • Designed and implemented GAN based DL network that improved SEM tool throughput by 30%. • Created robust image alignment solution that reduced misalignment by 90%.
Introduced a novel inspection solution for the 3D NAND technology which led to capturing new market segment by the company. Close collaboration with key customers, contrasting actual vs. simulated results, and delineating differences between real defect from nuisance, increased customer confidence. Developed and delivered solutions such as: 3D object recognition, anomaly detection, feature extraction, ML based anomaly classification. • Introducing novel inspection solution and forging close collaboration with key customers resulted in a brand new market segment for KLA, adding $200M to the revenue. • To improve ease of use, DL based anomaly classification was introduced, which led to 25% higher accuracy of anomaly classification.
Redesigned a product to match new demand higher location accuracy with much larger data volume. Led an agile team of algorithm, software, and application engineers to develop design based wafer inspection at a higher coordinate accuracy and throughput. Performed on site customer support across the globe for the smooth product introduction. Introduced flexible vertical and horizontal compute scaling to meet future demand. • Improved micro inspection area by thousand fold and location accuracy by 10x. • Introduction of the new technology added billion dollars to the revenue. • Followed up features were built based on the flexible compute infrastructure.