Antwerp Metropolitan Area
Project Management, People Management, Semiconductor manufacturing( Metrology, Inspection and Characterization, Lithography, Deposition, Image Analysis, Mask Design)
Led R&D projects to transform existing tools into next-generation Cyber-Physical Systems by integrating cutting-edge sensors and real-time data analytics. Started new collaborations with universities/consortia on machine intelligence and AI topics for improved robotics together with new sensors and hardware.
- As Group leader managing a group of ~30 people(3 teams - litho development, litho tracks and Exploratory Patterning Materials) and more than 70 assignees from various companies - Managing deliverables towards multiple partners(IDM's and vendors) involving EUV/E-Beam and immersion lithography processes and materials - Managing multiple design of masks for evaluating multiple types of advanced patterning
- Technical Project Manager for KLA+ / imec projects (valued around 55 million euros) (2019 -) - As advanced patterning project cluster lead for the imec(APC)/ASML (Technology Development Center) was responsible for new technology concept validation and early stage demonstration. All projects completed successfully with SPIE papers (2016-2018). - Currently, responsible for the machine learning activity for process control and inspection. Goal is to attract new potential partners and start new collaboration frameworks with start-ups as well as established data mining companies. Resulted in 3 new collaborations. - Work closely with DTCO to understand the challenges as we scale from node to node w.r.t. metrology/inspection especially with the introduction of scaling boosters. - Manage the staff as well as their deliverables of two teams (Litho for BEoL and Memory / Patterning Control & Inspection as well as co-ordinate inter departmental projects with indirect reports.
• Project leader for multiple Joint Development Project’s with KLA Tencor / ASML. • Developed project plans and statements of work specifying goals, strategy, scheduling, identification of risks, contingency plans, and allocation of available resources. • Gained knowledge on lithography (DPL, DSA,..) and PWQ methods for sub 28 nm nodes. • Worked on EUV resist defect issues and backside particle to front-side hotspot correlation . • Worked on pattern defectivity issues for sub 28 nm technology nodes, especially for III/V material integration in FEOL..
• Drove technology and equipment roadmaps with different IEDM partners and tool suppliers both internally and externally for 3D stacked IC program (memory on logic, memory on memory with TSV’s ). • Worked with TSV, BEOL, dicing, stacking and packaging teams to improve processes and yield. Gained experience on far BEOL integration and process issues. Co-ordinated multiple demos for path-finding activities to understand electroplating, micro-bump metallurgy and manufacturing issues. • Developed training plans and conducted yearly reviews for line engineers and other junior researchers. • Guided a start-up company NandaTech in IP generation and tool hardware and software improvements through the alpha/beta phase. This company was later acquired by Nanometrics for 20 million dollars. • Worked with business development to define technical annexes for prospective projects.
• Project leader for Joint Development Project’s with chemical companies like BASF, Fujifilm for evaluating new wet resist strip (post I/I) processes and integrating them sub 45 nm nodes. • Designed and scheduled complex process flows/experiments (DOE’s) for semiconductor manufacturing and process improvements. • Experienced in new product R&D, testing, IP generation and protection of new technology with equipment suppliers like Applied Materials, KLA Tencor, Nanometrics • Led cross-function teams across company to define requirements for new processes and equipment’s and finally helped in setting them up for the imec fabrication lines. • Developed processes for manufacturing and protecting micro-mirror based MEMS devices with ASML and Philips which finally led to yield improvements. • Experienced in transferring technology from the R&D phase to manufacturing and scale-up’s. • Applied FMEA and RCA analysis methods to critical projects for understanding and predicting show stoppers and came up with solutions for such issues which leaded to yield improvement. • Expert user of semiconductor inspection tools, SEM/EDX/KLA 2800/ SP2 systems. • Mentored masters level students and process and manufacturing engineers.
Acquired funding from BASF for PhD and Post-Doc via project proposals Successfully devised a method of coating buffer layers on textured substrates for superconductor applications which had been filed later for a patent. Synthesis of nanostructures and nanocomposite materials Developed high temperature stable substrates for thin film deposition. Experienced in various thin film deposition, growth and nucleation techniques with Pulsed Laser Deposition, PVD, sputtering (metals and oxides), solvent based coatings on different types of substrates (single crystals, sapphire, base metal’s). Laser annealing of dielectrics on different substrates Electrical and physical characterization of thin film capacitors HALT testing of ceramic capacitors as a function of dopant in different dielectrics Mentored masters level students