Robert F.

Principal Engineer at Infineon Technologies

Greater Nuremberg Metropolitan Area

About

Experienced in: - concept engineering - patent and claim drafting together with patent attorneys - FMEA - Six Sigma - innovation / pre-development projects - development projects - ramp up phase

Experience

  • Infineon Technologies (12 yrs)
    • Principal Engineer
      Apr 2026 - Present · 3 mos

    • Package Concept Engineer
      Dec 2017 - Present · 8 yrs 7 mos

      Define IC package concepts based on customer requirements. OSAT technology integration/assembly development in cooperation with subcontractors. Technology knowledge: general BE assembly, chip embedding (--> PCB + substrate) packages

    • Package layout engineer
      Jul 2014 - Dec 2017 · 3 yrs 6 mos

      Design and layout IC packages and the according drawings.

  • Working Student / Thesis at TDK-Micronas
    Jun 2013 - Mar 2014 · 10 mos

    Package/Product concept

  • Engineering Intern at SEMIKRON
    Jan 2012 - Apr 2012 · 4 mos

    Internship within Manufacturing Quality Backend