Manila, National Capital Region, Philippines
大家好！~ I hold a Bachelor's and Master's Degrees in Chemical Engineering from Mapúa University, Philippines. I recently passed the November 2024 Chemical Engineering Licensure Examination. I currently work as a Failure Analysis Laboratory Assistant at Integrated Micro-Electronics Inc., where I handle physical and chemical failure analysis techniques such as cross-sectional analysis of surface-mount components by optical microscopy/SEM and ENIG plating thickness measurement by XRF. Previously, I also had experience as a Research Intern at National Cheng Kung University in Tainan City, Taiwan, where I conducted laboratory-scale water treatment studies involving the adsorption of taste and odor micropollutants in drinking water. In my free time, I am learning Simplified Chinese (Mandarin). My language proficiency is currently at HSK Level 3, and I am planning to take HSK Level 4 soon. I also intend to achieve professional working proficiency in Traditional Chinese.
• Examines the solder joints, IMC thickness, and whisker formation of surface-mount components through cross-sectional optical microscopy/SEM • Measures PCB plating thickness (ENIG, ENEPIG, Electrolytic Ni-Au) through XRF • Tests for PCB ionic contamination via resistivity of solvent extract method • Identifies foreign material using FTIR spectroscopy • Prepares failure analysis data sheet for submission to internal/external clients • Projects handled: BMW G70 LCi DRL Crystal, Valeo SCALA Gen 3, Valeo IKS 2.3, Bosch MPC2, Zero Motorcycles MBB Gen 3/BMU Gen 7/CMU Gen 7, Tantalus Systems Smart Meter, Idneo DIM 3.1, Tong Hsing TOLT/TO247/T2PAK
• Conducted laboratory-scale water treatment studies involving the adsorption of taste and odor micropollutants (Geosmin, 2-Methylisoborneol) in drinking water • Optimized experimental parameters using response surface methodology • Handled instrumental chemical analysis using GC/MS, ICP-OES, UV-Vis, and FTIR Spectroscopy • Published a Scopus-indexed conference proceeding as a primary author
• Learned about the basic principles of Six Sigma and lean manufacturing in relation to the assembly and testing of electronic components