Greater Munich Metropolitan Area
Experienced Product Engineer and Engineering Team Lead Broad knowledge of Semiconductor Development and Manufacturing Process, expertise in Chip Packaging, Project Management, Validation Planning, Qualification
* Project Core Team representative for Product/Test Engineering and Bench/Lab for various projects ranging from Spin over Core to Platform projects (16/32-bit FRAM/Flash Microcontrollers) * Planning and coordination of work from Product/Test Engineering and Bench/Lab during the whole project life cycle (up to 15 engineers from different teams depending on project phase) * Planning and execution of offloads to production sites, close communication with fab, probe, assembly and final test sites * Analysis and review of characterization data uploaded by ATE and Bench validation teams. Lead of cross functional peer reviews * Group-internal package expert, contributor to package definition for new products * Logistics, material setups in production systems, wafer orders * Qualification planning and execution, qualification H/W development * NVM factory trim&config content expert