Ralf Hekmann

Principal Engineer at Infineon Technologies Switzerland

Switzerland

About

Experience

  • Principal Engineer - Digital Design at Infineon Technologies
    Jun 2025 - Present · 1 yr 1 mo

    Developing UWB technology at Infineon Switzerland (formerly 3dB Access)

  • Nordic Semiconductor (10 yrs 2 mos)
    • Principal R&D Engineer/Senior R&D Engineering Manager
      Jul 2018 - May 2025 · 6 yrs 11 mos

      Digital IC Design for Wireless SoCs. Responsible for digital design and integration of the 2.4GHz radio, NFC and other mixed signal designs. Participation in standards development. Managing a small team of Digital Design Engineers.

    • Senior R&D Engineer
      Apr 2015 - Jun 2018 · 3 yrs 3 mos

  • Digital IC Design Manager at Marvell
    Feb 2008 - Mar 2015 · 7 yrs 2 mos

    Digital IC Design for Wireless SoCs. Technical lead of NFC IP development and integration. Participation in standards development. Manager of a small team of Digital Design Engineers.

  • Design Engineer at Motorola
    Jan 2004 - Nov 2007 · 3 yrs 11 mos

    Digital IC design, system simulation and prototype platform development for products in the Government and Enterprise Mobility Solutions business unit.

  • Design Engineer at Motorola Inc, European Semiconductor Group, Geneva, Switzerland
    Nov 2000 - Dec 2003 · 3 yrs 2 mos

    Digital IC design for wireless products.