Rajlee Dhabekar

Verification Engineer @ Etched

Cupertino, California, United States

About

I am a pro-active RTL Design and Verification Engineer with a keen eye on playing the Power, Performance and Area trade-offs in Design and effectively debugging critical design errors with my verification skills. My philosophy " If things stopped being easy you are on the right path"

Experience

  • Member of Technical Staff at Etched
    Jun 2026 - Present · 2 mos

  • Application Specific Integrated Circuit Verification Engineer at Amazon Web Services (AWS)
    Aug 2025 - Jan 2026 · 6 mos

    • Developed a reusable coverage block (with cross and transition coverage) for the tensor compute block’s new State buffer memory interfaces. • Built and deployed a novel verification flows for incremental coverage aggregation, enabling faster merges (85% less time to merge) improving total regression run time and overall quality of verification.

  • Verification Intern at NVIDIA
    May 2025 - Aug 2025 · 4 mos

    • Contributed to Tegra SoC memory controller subsystem – chip-to-chip hub verification. • Developed scoreboard checks to ensure correctness and protect test intent in performance testcases. • Created Perl automation scripts (using cursor) for coverage and constraints generation for CHI (coherent hub interface) AMBA Protocol interface. • Gained hands-on experience with UVM methodology, SystemVerilog, and Synopsys VCS/Verdi.

  • Silicon Labs (Telangana, India)
    • IC Design Verification Engineer
      Aug 2022 - Nov 2023 · 1 yr 4 mos

      • Contributed to the development of a 22nm low power wireless IoT chip, with a primary focus on developing and managing SystemVerilog (SV) and Universal Verification Methodology (UVM) based test cases. These responsibilities extended to both the top-level design and subsystems, with a particular emphasis on integrating the EUSART module at the top level. • Engaged in a project involving a 40nm chip with a focus on Time Division Multiplexing (TDM), I2S module. Acquired expertise in the testbench components at the module level, formulated a comprehensive test plan, and crafted directed test cases to identify RTL bugs in newly integrated features. Produced coverage reports at the module level, specifically for the TDM component. • protocols: AMBA APB, AHB, and AXI and MMLDMA • Worked on testbench (stimulus, agent, monitor, checker) development and verification of having c-based reference model inside the testbench.

    • IC Design Verification Intern
      Jan 2022 - Jul 2022 · 7 mos

      • Working on the QSPI model. Verified QSPI using directed testcases for various QSPI modes. • Integrated QSPI memory models from different vendors into the UVM based verification testbench. • Ported testbenches and testcases from VCS environment to Questa and helped in finding transition errors. • Developed regression files in Silicon Labs Design Environment. • Checked for firmware generation issues and worked with in the team to run the testcases successfully in Silicon Labs design flow. • Developed an architectural understanding and designed to tape-out lifecycle of Wireless SOCs

  • VLSI Trainee at Semi Design
    Apr 2021 - Jan 2022 · 10 mos