Piya Kapoor

MatSE @ Columbia

New York City Metropolitan Area

About

I am passionate about advancing semiconductor and materials innovation through research-driven problem solving and hands-on experience. My interests also revolve around fashion tech and product formulation/development from a materials science perspective. My background involves process engineering in both the semiconductor industry and the pharmaceutical industry through my internships with TI and Bristol Myers Squibb. At UIUC I contributed to research projects including polymer seal design, molecular simulations of adsorbents, and designing hydrogel permeability testers. Through these projects I've been able to build on my skills in process analytics, R&D, and materials characterization. Currently pursuing my MS in Materials Science and Engineering at Columbia University, I am eager to build on my skills and apply my expertise to cutting-edge challenges regarding semiconductor materials and advanced manufacturing.

Experience

  • Chemical Engineering R&D Intern at Carbion
    May 2026 - Present · 2 mos

  • Graduate Research Assistant at Columbia University Irving Medical Center
    Jan 2026 - Present · 6 mos

  • Process Engineering Intern at Texas Instruments
    May 2024 - Aug 2024 · 4 mos

  • Process Analytics and Engineering Intern at Bristol Myers Squibb
    Jun 2023 - Aug 2023 · 3 mos

  • The Grainger College of Engineering (1 yr 7 mos)
    • Undergraduate Research Assistant
      Aug 2022 - May 2023 · 10 mos

      · Running molecular simulations on various adsorbents and collecting data on energy densities to analyze their properties

    • Undergraduate Research Assistant
      Feb 2022 - Aug 2022 · 7 mos

      · Designing and building a permeability tester for various hydrogels · Analyzing the ranges of Darcy permeability that can result from differences in applied pressures, thickness of hydrogel, and polymer type

    • Engineering Open House Project
      Nov 2021 - Mar 2022 · 5 mos

      · Working on developing a demonstration and presentation on the science behind different materials and their fracture points, while also taking into consideration procedures like work hardening (specifically for metals)