Pierre Gandolfo

Power semiconductors, VCSEL and MEMS (EMEA microelectronics)

Lausanne, Vaud, Switzerland

About

Areas of specialty - Wireless/RF (WLAN, WPAN, WBAN, RADAR, ADAS, wake-up radio, RTLS, IEEE 802.11, Wi-Fi, HiperLAN2, HomeRF, Bluetooth (BR/EDR and Low Energy), IEEE 802.15.3/a, wireless 1394 PAL, UWB, Ultrawideband, DECT, WDCT, SIP/RTP, UPnP/DLNA, WiMedia/ECMA-368 (inc. WLP PAL & WAM), Wireless USB, IEEE 802.15.4(a), 6LoWPAN/IPV6/ND/ROLL (IPSO), Zigbee NWK/APS/AF/ZDO, DASH7/ISO18000-7, Continua Health Alliance) - Motor driver/controller (sensored/sensorless BLDC, PMSM, SVPWM, FOC, Bipolar stepper, matrix converter, Space Vector) - Soft-switching power management converters and energy harvesters (e.g. LLC resonant, ACF, dual-buck, resonant start-up converter, piezo transformer) Other microelectronics/semiconductor interests: - 3D-ToF/LiDAR, Compressive sensing/Sparse sampling, neuromorphic Spiking Neural Networks (SNN), OxRAM, Hadamard code and chiplet, GalliumNitride (GaN) HEMT, Silicon on Insulator, Silicon Carbide, Power semiconductors (MOSFET, IGBT, Thyristor), BCD (bipolar-CMOS-DMOS), Silicon qubit, Microfluidics and Mass spectrometry, VCSEL/Photonics/PIC, THz imaging, MEMS sensors.

Experience

  • Director of Technology and Sales (EMEA Semiconductors / Microelectronics) at SMIC
    Dec 2021 - Present · 4 yrs 7 mos

    Foundry for BCD (bipolar/CMOS/DMOS bulk/SOI), MEMS (e.g. inertial, pressure, microphone, BAW resonator/piezoelectric), Photonics (VCSEL, microlens, mirror) and Power semiconductors inc, MOSFET (trench, spilt-gate, dual-channel trench gate, super-junction), IGBT (inc. vertical trench gate, field stop with carrier lifetime control and reverse-conducting options), compound WBG SiC (Silicon Carbide planar and trench) as well as enhanced-mode GaN-on-Si HEMT (Gallium Nitride p-GaN, MIS-HEMT, cascode) and Power modules/IPM (DBC/AMB substrate) for automotive xEV, industrial, renewable energies and consumer markets. Power conversion topologies expertise: Bridgeless totem pole PFC, Passive-clamp flyback (DCM-QR), Active-clamp flyback, Asymmetric half-bridge, LLC resonant half-bridge, Phase-shifted full-bridge DC-DC, 3-phase Vienna rectifier, BLDC/PMSM motor, Induction motor (VFD), ACAC matrix converter for VFD motor with 4-quadrant operation, Dual-buck inverter, ANPC inverter, Bridgeless LED driver. MEMS expertise: Bulk/surface micromachining, DRIE etching, HF vapor etching/Porous silicon + sintering, Plug-up SOI, wafer alignment/bonding, TSV, sealed dual membrane, piezo-resistive vs. capacitive Wheatstone bridge...

  • Technical Marketing and Sales Director, Europe at ASE Group Global
    May 2018 - Dec 2021 · 3 yrs 8 mos

    IC (Integrated Circuits) Assembly and Test with focus on RF/Connectivity, Radar/LiDAR, Power Management, DC motors, sensors and AI/CNN/SNN

  • Technical Marketing and Sales Director, Europe at Siliconware Precision Industries
    Jun 2014 - May 2021 · 7 yrs

    IC (Integrated Circuits) Assembly and Test with focus on RF/Connectivity, Radar/LiDAR, Power Management, DC motors, sensors and AI/CNN/SNN

  • Entrepeneur at TrIP-Sen
    2008 - 2021 · 13 yrs

    Wireless semiconductor start-up developing reconfigurable (Bluetooth Low Energy -- Zigbee Healthcare) and cognitive radio platforms for the remote healthcare market (Continua Health Alliance)

  • Marketing at TDK-Micronas
    2012 - 2014 · 2 yrs

    Semiconductor company providing controller and driver IC solutions for DC motors (BLDC, Stepper, PMSM)