Ho Chi Minh City, Vietnam
-Responsible for the package and process area of the quality and reliability function during Factory Certifications, New Product Integration (NPI) and High Volume Manufacturing (HVM): -Define certification requirements for smooth transfer and start up of new technology and ramp into HVM. -Responsible for excursion management (internal factory and customer issues) to ensure effective containment and disposition of material through proper risk assessment and drive effective corrective action for root cause fix. -Define and monitor a set of quality health indicator for excursion prevention as well as lead in process control & excursion prevention. -Reviewing and approving of Change Control for Process and/or Equipment. -Evaluates, from a reliability standpoint, the materials, properties and techniques used in production
-Electrical Characterization of failing IC’s. These failures can be external customer complaints as well as design bugs, test escape issues or yield issues, assembly issues. -Coordination of the physical analysis once failure mechanism has been defined. -Initiate Cross functional cooperation in order to identify the failure mechanism and resolve issues. -Further develop and enhance analysis techniques in order to offer support for complex failure mechanism determination. -Electrical characterization and bench testing of failure mode using lab equipment like power supplies, parametric analyzers, oscilloscopes, other bench test equipment, XRAY, CSAM, photo emission, Chemical process to develop a Failure Analysis plan. Complete projects and document procedures and processes related lab development, advancement and maintenance activities.
-Research products to provide technical advice to customers to support business -Contacting technical foreign partners for an understanding of how to fix the problem -In charge of setting up, assembling, using instructional equipment for customers upon delivery -Repair, maintenance and replacement of circuit boards, mechanical components in system machines
-Join in a science project to prepare new materials to enhance properties of semiconductor device -Improve vacuum deposition machine to apply suitable technique to create thin semiconductor layers -Learns about structure of semiconductor devices and how to fabricate them at LAB -Plans and executes laboratory research. Combines the knowledge of physical to solve the problems during fabrication