Wilsonville, Oregon, United States
High-Tech R&D.
Manufacturing, Mechanical Engineering, and Technology Department
Structural Design, Analysis and Testing for Computer Systems. • Lead structural architecture pathfinding at Data Center and AI Group (DCAI). Received 6 Intel High-Five Patent Awards in 2021-2024 (30+ U.S. patent applications filed). • BGA Solder Joint Reliability - expert in AI system level structural analysis in OAM and PCIe modules. Root-caused SJR failure and developed patented solutions for large BGA packages with stiffener. • CPU LGA socket stack retention development. Responsible for the structural design and analysis of Xeon and Itanium loading mechanisms and heatsink from 2006 to 2020. • JEDEC and industry DDR5 structural reliability assessment - helped both Intel and the industry transition from non-SMT DDR4 to SMT DDR5 connector by mitigating Solder Joint Reliability risk (SJR) which enabled the entire ecosystem. • IPC/JEDEC standard deployment. "Phil is an IPC 6-10D committee member and was Key player in development of IPC/JEDEC 9702, 9703 and 9704 standards. Part of his work and publications on motherboard bend test, strain gage test and shock tests are adopted by the three standards.” Reza Ghaffarian, Ph.D., Chair, IPC Product Reliability Committee • National Electronics Manufacturing Initiative (iNEMI) member of lead-free rework WG. Lead engineer and author of the flexural test and evaluation of NEMI recommended SnAgCu lead-free solder (2003-2005). Received Intel TMG Excellence Award.
Modeling, simulation and testing for inkjet cartridges and printers. • FEA analyst in Advanced Research Lab under the leadership of Skip Rung. • Worked closely with the pioneers of Thermal Inkjet (TIJ) Manufacturing Technologies, including Paul McNeallen, Neils Nielsen, Bill Knight, Marzio Leban ...
NSF Fellowship. The Institute for Mechanics and Materials (IMM, NSF-UCSD) Outstanding Achievement Award for Research in Micromechanics for Microelectronics Materials, Osseointegration Technique for Artificial-Joint Fixation, and Micromechanics-Based Design and Analysis of FRC Composites. • Research with Bioengineering Dept. at UCSD (Dr. Richard Skalak, a pioneer in biomedical engineering) and Institute for Applied Biotechnology at Sweden (Dr. Per-Ingvar Brånemark, the inventor of titanium dental implant) on “Clinical Shape Design of Titanium Prosthesis and Stress Analysis of Osseo-integrated Titanium Bolts/Bone Interface for Total Hip Joint Replacement.” Research with Italian scholars on Bone-Dental Implant. Mentorship under Dr. Y.C. Fung. • Research with Cadence Design System, Inc. on “Cratering in 90:10 Pb:Sn Cast Columns following Shearing in Ceramic Column Grid Array (CCGA) Packages.” • Development with Unisys Corporation on numerical modeling of “Chips Sorting by the Air Jet Surface Cooling Technique” and “Reliability and Aging of Ceramic Column Grid Array (CCGA) Packages under Thermal Cycles.” • Research with the Dept. of Electrical and Computer Engineering at UCSD on “Finite Element Analysis of Thin Film Stressor Induced Strain Field in GaAs/AlGaAs Quantum Well Structure.” • Continued research on “Micromechanics-Based Design of FRC Materials” with MIT.