Lake Mohegan, New York, United States
Innovative and versatile R&D engineer with deep familiarity of electronic packaging. I quickly see connections between disparate disciplines, frequently resulting in new intellectual property, either within certain technologies, or resulting in entirely new technologies. With working knowledge of 3D design tools such as Autodesk Inventor, new concepts are rapidly transformed into testable prototypes.
Invented & developed new interconnect technology called IMS Injection Molded Solder. IMS was recently commercialized by IBM for wafer bumping under the name C4NP. Development continues for other non-wafer solder bumping applications. Have over 130 issued or pending patents in electronic packaging.
Project leader for IMS / C4NP. This was a commercialization effort which led to IBM's adoption of a new wafer bumping technology for lead-free alloys. IMS avoids both the complexities and costs associated with plating or evaporation. Currently, IMS is being commercialized for bumping packaging substrates, either in addition to silicon wafers, or as a substitute for wafer bumping.